The 3Si machines are one of the best full 3D inspection systems on the market. A closed-loop, dual servo-motor drive system, highresolution linear scale, and rigid gantry structure provide unsurpassed accuracy and repeatability for absolute measurements. Saki’s CoaXPress interface in the overhead camera captures images 1.7 times faster than previous models. Three camera resolution levels—7μm, 12μm, 18μm – are available to match application requirements.

Saki’s unique Warpage Adjustment provides stable inspection for boards with large warpage such as flexible printed circuits.

In addition to inspecting each solder desposit, we inspect the relative variations in the BGA to increase the quality of small and fine-pitch components. Use of Gerber and Placement machine centroid data make it possible to output and manage data by component, and use the same data for both AOI and SPI systems using Saki’s Self-Programming (SSP) Software.